Researchers build brain-like memory device for AI sensors that may improve energy efficiency — phototransistor device combines light sensing, memory, and processing to cut data movement

Oregon State University researchers have developed a brain-inspired phototransistor that combines light sensing, memory, and signal processing in one device. The hardware can electronically control how long optical memorie…

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Nvidia reveals AI robots that taught themselves to install GPUs into motherboards — video shows robot ‘solve high-precision tasks like… installing GPUs all by itself’

Nvidia showcases agentic robots that can teach themselves high-precision and dexterous tasks – like PC building – in the real world.
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U.S. gov’t asks court to dismiss NAACP lawsuit against Elon Musk’s xAI over use of unpermitted gas turbines — DOJ says Grok model running at Colossus 2 ‘supports mission-critical operations’

The US government is seeking dismissal of a lawsuit from the NAACP, arguing that the Colossus 2 data center is crucial for national security. The data center runs the Grok Gov AI model, and the government claims a shutdown…

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Intel’s performance-enhanced 18A-P process enters risk production — drop-in 18A upgrade promises 9% performance improvement at iso-power, cuts thermal resistance by 40%

Intel’s enhanced 18A-P has entered risk production, laying the groundwork to ramp the node into full production in the coming months.
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Chinese fab SMIC’s 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei’s sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis’s new teardown lab

SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.
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Qualcomm mulls taking over Jim Keller’s Tenstorrent, report claims — deal for AI chipmaker would value the company at between $8 billion and $10 billion

Qualcomm is in talks to buy RISC-V-based AI accelerator and CPU developer Tenstorrent for $8 billion – $10 billion.

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TSMC says panel packaging won’t replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

TSMC is exploring panel-level packaging and is working on its CoPoS technology, but the company’s Kevin Zhang says wafer-level packaging technologies is considerably more advanced than panel-level packaging.
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Project Jupiter AI data center build raises concerns about water usage in rural New Mexico desert — Oracle calls water usage ‘negligible’ for 11 million gallon one-time fill

Oracle’s Project Jupiter is targeting a New Mexico desert already struggling with water consumption, but the company assures residents that the data center’s water usage is “negligible.”
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Multiple small Tennessee counties pass temporary data center bans — Nashville also passed near-unanimous moratorium on first reading

Two jurisdictions in Tennessee just passed a data center moratorium as three more a set to vote on bills that delay these projects. These temporary bans have gained widespread support, especially in rural regions where dev…

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Marvell details vision of optically-interconnected data centers spanning across thousands of kilometers — new interconnects sampling later this year would allow CSPs to pool resources based on workload

Marvell shares its vision for optically connected data centers, connecting devices across hundreds of kilometers, and the company already has hardware to build them.
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