Seven hospitalized after toxic gas fire at SK hynix advanced memory plant — Cheongju 4th campus incident today led to all 3,600 staff being evacuated

Thousands of SK hynix employees fled their factory stations earlier today as a fire broke out in a room where fluorine gas was used.
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US export controls are pushing China’s AI chip industry away from GPUs and toward custom silicon
 US export controls are pushing China’s AI chip industry away from GPUs and toward custom silicon

China’s AI chip industry is no longer trying to build an Nvidia clone. Under sustained US export controls that block access to the most powerful general-purpose GPUs, the country’s largest technology companies are pivoting toward application-specific i…

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TikTok owner ByteDance is reportedly developing its own custom AI CPUs — company looks to ease China’s dependence on US chipmakers

TikTok owner Bytedance reportedly developing its own custom CPUs in a bid to reduce costs and dependence from US chipmakers
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Trailing-edge foundry roadmaps for GlobalFoundries, UMC, and SMIC — mature node chipmakers each pursue differing strategies and IP

We explore Globalfoundries, UMC, and SMIC’s individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.
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Chinese university builds 3D chip design tool tailored to Huawei’s ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
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China adds homegrown AI chips to ‘secure and reliable’ procurement list for the first time — nine options added as move away from Nvidia continues

The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.
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SK hynix unveils ‘iHBM’ thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers

SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-k…

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Imec builds world’s first High-NA EUV-fabricated quantum dot qubit device — breakthrough could pull quantum computing onto the same manufacturing roadmap as next-gen AI processors, compressing timelines

Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing…

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Huawei claims sanctions-busting breakthrough with 1.4nm-class chips by 2031, claims 55% higher transistor density — firm claims new LogicFolding chip architecture can bypass EUV restrictions, introduces ‘Tau Scaling Law’ to replace Moore’s Law

Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potenti…

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Samsung’s $400,000 payout for memory workers sparks revolt as other divisions get only $4,000, fueling intentional production slowdowns — internal resentment disrupts packaging operations, major AI chip project decisions to a complete halt

It’s understood that meetings are being canceled across Samsung’s non-memory and shared business units.

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