TSMC is exploring panel-level packaging and is working on its CoPoS technology, but the company’s Kevin Zhang says wafer-level packaging technologies is considerably more advanced than panel-level packaging.
…
The Kazakhstan AI deal is signed. Kazakhstan has agreed a set of accords with Firebird, a US startup backed by Nvidia, to build artificial-intelligence data centres that could draw as much as $10bn in investment, as the oil-and-gas producer tries to re…
The Enflame IPO is on. Shanghai Enflame Technology, an AI-chip startup backed by Tencent, has won listing-committee approval to raise about 6 billion yuan ($888m) on the Shanghai Stock Exchange’s STAR board, according to Bloomberg. It is the last of Ch…
Nvidia has started pitching its Vera CPU to Chinese customers. Orders can begin now, and deliveries could start as soon as August, Reuters reported on Friday, citing three people familiar with the talks. It is a workaround dressed as a product launch. …
The US-backed plan to build an AI and supply-chain hub in the Philippines now has a number attached: about $10bn in initial investment, with more to follow, according to the official leading the Philippine side. It also has a striking term on the table…
TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expans…
SK Hynix is preparing to list in the United States in a deal that could raise as much as $14bn as soon as August, according to people familiar with the plan. The Korean memory maker has made a confidential filing for American depositary receipts, and t…
Chinese startup Prinano claims it produced 8-inch photonic chip wafers without DUV lithography, using nanoimprint technology that cuts costs by 90%.
…
TSMC says it does not have enough capacity to handle all the demand from AI hyperscalers, with CEO C.C. Wei saying that it will take a long time before it can match customer demand. This is an opportunity for Intel, thoug…
Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
…