Chinese startup Langdao Silex showcased its laser-produced plasma EUV source at a trade show, but the technology will likely take many years before it gets to decent EUV power levels. Even if it does, China will need many more advancements to build a practical EUV lithography tool.
“Some of the companies at the forefront of AI are telling Qualcomm, ‘By 2028, I need to make sure that I have the ability to run at least a hundred billion parameter model into a phone.’” Qualcomm chief executive Cristiano Amon said this on Sources, Al…
This $4 billion industrial park would make it easier for smaller Taiwanese companies who can’t afford to build their own sites in the U.S. to expand and follow major Taiwanese manufacturers like TSMC and Foxconn.
The EU is reportedly negotiating with Beijing to remove Chinese restrictions on German ASML supplier Sindlhauser Materials, to prevent the China-dependent company from going out of business
ASML vows to expand production capacity amid growing demand, record earnings and profitability.
ASML says customers are already placing orders for advanced chipmaking tools years in advance, with AI-driven semiconductor demand remaining strong enough to strain capacity despite planned expansions
TSMC’s management confirms that the company is looking forward to expand U.S. capacity beyond Arizona and Texas is one of its options. However, to become a part of the Terafab project, it insists on running the whole fab.
Russian semiconductor players shows off bespoke CPU and SoC designs — Arm and Elbrus architectures on display
Two workers have died in an explosion at Intel’s Kiryat Gat chip plant; police suspect a gas cylinder malfunction.
Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But where are Intel’s EMIB and Foveros technologies today and where are they heading?