Get 16GB of DDR5 RAM free when you buy AMD’s 9900X and an Asus TUF motherboard — $659 Newegg combo saves $274, and you get a free 240mm AIO
Get 16GB of DDR5 RAM free when you buy AMD’s 9900X and an Asus TUF motherboard — $659 Newegg combo saves $274, and you get a free 240mm AIO

Save $274 and snag 16GB of DDR5 RAM for free in this 3-item Newegg combo with Ryzen 9 9900X, Asus TUF Gaming X870E-Plus Wifi7, and 16GB of dual channel Team Group T-Force Vulkan RAM

China’s memory-making champion smashes DDR5-8800 barrier on AMD platform — CXMT chips close the gap with SK hynix
China’s memory-making champion smashes DDR5-8800 barrier on AMD platform — CXMT chips close the gap with SK hynix

Colorful shows off the overclocking potential on new memory kits equipped with CXMT integrated circuits.

Scientist says RAM pricing has risen to normalized 2007 levels, AI shortage undid 20 years of progress in a matter of months — memory prices had been falling exponentially for decades
Scientist says RAM pricing has risen to normalized 2007 levels, AI shortage undid 20 years of progress in a matter of months — memory prices had been falling exponentially for decades

The per GB price of memory modules have gone back to 2007 levels because of AI demand. This is the first time that prices have shot up in the realm of tech, Lemire says.

$1 billion of iPhone 18 Pro chips ‘on the shelves awaiting packaging’ due to DRAM shortages — memory shortages reportedly put a wrinkle in Apple’s launch plans
$1 billion of iPhone 18 Pro chips ‘on the shelves awaiting packaging’ due to DRAM shortages — memory shortages reportedly put a wrinkle in Apple’s launch plans

Apple reportedly as $1 billion worth of iPhone 18 processor wafers awaiting packaging, which hasn’t been completed due to DRAM shortages.

Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies
Samsung debuts three next-generation memory technologies for AI data centers — zHBM, zNAND-O, and BV-NAND all rely on advanced wafer bonding technologies

Samsung uses FMS to unveil three next-generation memory technologies — zHBM, zNAND-O, and BV-NAND — that target different markets, but all rely on advanced wafer-bonding techniques.

China’s CXMT targets 30% DRAM memory market share by 2030 with sixth mega-fab — future plans bottlenecked by access to advanced chipmaking tools
China’s CXMT targets 30% DRAM memory market share by 2030 with sixth mega-fab — future plans bottlenecked by access to advanced chipmaking tools

ChangXin Memory Technologies (CXMT) began considering building its sixth DRAM fab in China to boost memory output in the coming years. If all announced projects proceed as planned, the company’s production capacity could more than double in the mid-term future.

New Micron lawsuit reignites fight over New York fab — complaint alleges ‘forever chemicals’ will flow into Oneida River
New Micron lawsuit reignites fight over New York fab — complaint alleges ‘forever chemicals’ will flow into Oneida River

Micron’s New York manufacturing facility is back in the crosshairs of another environmental lawsuit, claiming its wastewater and air permits should be nullified.

Lexar lists 32GB DDR5 memory with homegrown Chinese chips — 3,999 Yuan ($592) price undercuts hopes for cheaper CXMT-powered RAM

Lexar’s latest Thor RGB kit likely uses CXMT-made DRAM, but its pricing remains comparable to premium DDR5 memory from established brands.