China’s top DRAM maker CXMT sues Pentagon over its blacklisting — argues chips are standard civilian JEDEC spec, not defense hardware

Chinese DRAM maker CXMT wants the US Department of Defense to remove it from the list of companies linked to the Chinese military.

MSI brings DDR4 back to gaming laptops amidst DRAM crisis — Katana 15 HX C14 available with up to Core i9-14900HX and RTX 5070

With 32GB DDR4 SO-DIMM memory kits costing roughly half as much as comparable DDR5 kits, MSI’s new Katana 15 HX C14 could help reduce the impact of soaring memory prices.

SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029
SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029

SK hynix breaks ground on HBM assembly plant in the U.S. that will form a connection between DRAM wafers produced in South Korea and their consumers among AI companies in the U.S.

Nvidia custom ‘NVHBM’ promises 30% higher bandwidth, 15% lower power than commodity HBM4e — custom base die and PHY will be available to NVLink Fusion partners
Nvidia custom ‘NVHBM’ promises 30% higher bandwidth, 15% lower power than commodity HBM4e — custom base die and PHY will be available to NVLink Fusion partners

Nvidia has unveiled NVHBM, a custom high-bandwidth memory implementation that promises higher bandwidth and lower power for customers building chips within the NVLink Fusion partner program.

Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth
Hot Chips 2026: Samsung makes LPDDR5X smart with logic unit in memory — LPDDR5X-PIM is 3.01x faster than LPDDR5X in AI inference with 8x the bandwidth

Samsung detailed the industry’s first LPDDR5X-PIM at Hot Chips 2026, adding logic directly to memory to speed up data-intensive workloads like AI inference.